APA (7th ed.) Citation

Wong, E., & Mai, Y. W. (2015). Robust design of microelectronics assemblies against mechanical shock, temperature and moisture. Woodhead Publishing.

Chicago Style (17th ed.) Citation

Wong, E-H, and Y. W. Mai. Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture. Cambridge, UK: Woodhead Publishing, 2015.

MLA (9th ed.) Citation

Wong, E-H, and Y. W. Mai. Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture. Woodhead Publishing, 2015.