rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    title: ISTFA 2014
    sub title: conference proceedings from the 40th International Symposium for Testing and Failure Analysis ; November 9-13, 2014, George R. Brown Conversion Center, Houston, Texas, USA
  name:
    name part: International Symposium for Testing and Failure Analysis 2014 : Houston, Tex.)
    role:
      role term: creator
  name:
    name part: Knovel (Firm)
  name:
    name part: Electronic Device Failure Analysis Society
    role:
      role term: organizer.
  name:
    name part: ASM International
    role:
      role term: organizer.
  type of resource: text
  genre: conference publication
  genre: Electronic books.
  genre: Conference papers and proceedings.
  origin info:
    place:
      place term: ohu
    date issued: 2014
    copyright date: 2014
    issuance: monographic
  language:
    language term: eng
  physical description:
    form: remote
    extent: 1 online resource (560 pages) : color illustrations, photographs
  table of contents: ""Title Page""; ""TitlePage_2014""; ""COPYRight Page""; ""EDFAS 2014 Board of Directors""; ""Organizing Committee-2014""; ""Technical Program Committee -- 2014""; ""Contents_2014""; ""ISTFA2014_Combined""; ""cp2014istfa001""; ""cp2014istfa005""; ""cp2014istfa006""; ""cp2014istfa012""; ""cp2014istfa023""; ""cp2014istfa028""; ""cp2014istfa033""; ""cp2014istfa038""; ""cp2014istfa043""; ""cp2014istfa049""; ""cp2014istfa055""; ""cp2014istfa065""; ""cp2014istfa073""; ""cp2014istfa082""; ""cp2014istfa087""; ""cp2014istfa094""; ""cp2014istfa100""; ""cp2014istfa105""; ""cp2014istfa110""
  table of contents: ""Cp2014istfa115""""cp2014istfa125""; ""cp2014istfa130""; ""cp2014istfa136""; ""cp2014istfa143""; ""cp2014istfa148""; ""cp2014istfa152""; ""cp2014istfa156""; ""cp2014istfa166""; ""cp2014istfa172""; ""cp2014istfa178""; ""cp2014istfa184""; ""Combined_189-536""; ""Analysis of InGaAs Epi Defects by Conductive AFM""; ""Failure analysis of bit line to SNC leakage fail in 2xnm DRAM using Nano- Probing technique""; ""Analysis of an Anomalous CMOS Transistor Exhibiting Drain to Source Leakage âß? Its Model and Cause""; ""Feature Based Non-Destructive Fault Isolation in Advanced IC Packages""
  table of contents: ""Understanding the Cu Void Formation by TEM Failure Analysis""""microPREPTM -- A New Laser Tool for High-Throughput Sample Preparation""; ""Using Energy Dispersive Spectroscopy (EDS) to Determine the Resistance of FIB Jumpers for Circuit Edit""; ""New Ion Source for High Precision FIB Nanomachining and Circuit Edit""; ""Evaluation of Power SiC-MOSFET Using Super-Higher-Order Scanning Nonlinear Dielectric Microscopy: Imaging of Carrier Distribution and Depletion Layer""; ""Imaging Performance of aSIL Microscopy on Subsurface Imaging of SOI Chips""
  table of contents: ""Methods to Reconstruct SEM and Optical Probe Tips using a FIB Tool""""Near-Field Scanning Optical Microscopy for Through-Silicon Imaging and Fault Isolation of Integrated Circuits""; ""Characterization and simulation of a body biased structure in triple-well technology under pulsed photoelectric laser stimulation""; ""Continuous-wave 1064nm laser for Laser Voltage Imaging and Probing Applications""; ""Marginal Failure Diagnosed with LADA: Case Studies.""; ""Sample Preparation for High Numerical Aperture Solid Immersion Lens Laser Imaging""; ""TDR Analysis On Short Transmission Lines""
  table of contents: ""Productive Polishing TEM Sample Preparation Methodology Development""""Optimization of TEM Sample Preparation to Reduce the Overlapping of TEM Images""; ""Delayering on Advanced Process Technologies using FIB""; ""Failure Analysis Enhancement by Incorporating a Compact Scan Diagnosis System""; ""Debugging Phase-Locked Loop Failures in Integrated Circuit Products""; ""A Novel Method for the Specified Site Planar View TEM Sample Preparation""; ""Investigation of Protection Layer Materials for Ex-situ âß?lift-outâß? TEM Sample Preparation with FIB for 14nm FinFET""
  note: organized by Electronic Device Failure Analysis Society, ASM International.
  note: Includes index.
  subject:
    topic: Electronics
    topic: Materials
    topic: Testing
    genre: Congresses
  subject:
    topic: Electronic apparatus and appliances
    topic: Testing
    genre: Congresses
  subject:
    topic: Electronic apparatus and appliances
    topic: Testing
    topic: Congresses
  subject:
    topic: Electronics
    topic: Materials
    topic: Testing
    topic: Congresses
  subject:
    topic: Electronic apparatus and appliances
    topic: Testing
  subject:
    topic: Electronics
    topic: Materials
    topic: Testing
  classification: TK7871 .I884 2014eb
  classification: 621.381
  related item:
    title info:
      title: ISTFA 2014 : conference proceedings from the 40th International Symposium for Testing and Failure Analysis ; November 9-13, 2014, George R. Brown Conversion Center, Houston, Texas, USA
    name:
      name part: International Symposium for Testing and Failure Analysis (40th : 2014 : Houston, Tex.).
    origin info:
      publisher: Materials Park, Ohio : ASM International, ©2014
    physical description:
      extent: xx, 540 pages
  identifier: 9781627080750
  identifier: 1627080759
  identifier: 9781680155143
  identifier: 1680155148
  identifier: 1627080740
  identifier: 9781627080743
  identifier: http://proxy.library.tamu.edu/login
  record info:
    record content source: E7B
    record creation date: 150109
    record change date: 20260609152801.3
    record identifier: in00003832587
    language of cataloging:
      language term: eng