http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
conference proceedings from the 40th International Symposium for Testing and Failure Analysis ; November 9-13, 2014, George R. Brown Conversion Center, Houston, Texas, USA
International Symposium for Testing and Failure Analysis 2014 : Houston, Tex.)
Electronic Device Failure Analysis Society
1 online resource (560 pages) : color illustrations, photographs
""Cp2014istfa115""""cp2014istfa125""; ""cp2014istfa130""; ""cp2014istfa136""; ""cp2014istfa143""; ""cp2014istfa148""; ""cp2014istfa152""; ""cp2014istfa156""; ""cp2014istfa166""; ""cp2014istfa172""; ""cp2014istfa178""; ""cp2014istfa184""; ""Combined_189-536""; ""Analysis of InGaAs Epi Defects by Conductive AFM""; ""Failure analysis of bit line to SNC leakage fail in 2xnm DRAM using Nano- Probing technique""; ""Analysis of an Anomalous CMOS Transistor Exhibiting Drain to Source Leakage âß? Its Model and Cause""; ""Feature Based Non-Destructive Fault Isolation in Advanced IC Packages""
""Understanding the Cu Void Formation by TEM Failure Analysis""""microPREPTM -- A New Laser Tool for High-Throughput Sample Preparation""; ""Using Energy Dispersive Spectroscopy (EDS) to Determine the Resistance of FIB Jumpers for Circuit Edit""; ""New Ion Source for High Precision FIB Nanomachining and Circuit Edit""; ""Evaluation of Power SiC-MOSFET Using Super-Higher-Order Scanning Nonlinear Dielectric Microscopy: Imaging of Carrier Distribution and Depletion Layer""; ""Imaging Performance of aSIL Microscopy on Subsurface Imaging of SOI Chips""
""Methods to Reconstruct SEM and Optical Probe Tips using a FIB Tool""""Near-Field Scanning Optical Microscopy for Through-Silicon Imaging and Fault Isolation of Integrated Circuits""; ""Characterization and simulation of a body biased structure in triple-well technology under pulsed photoelectric laser stimulation""; ""Continuous-wave 1064nm laser for Laser Voltage Imaging and Probing Applications""; ""Marginal Failure Diagnosed with LADA: Case Studies.""; ""Sample Preparation for High Numerical Aperture Solid Immersion Lens Laser Imaging""; ""TDR Analysis On Short Transmission Lines""
""Productive Polishing TEM Sample Preparation Methodology Development""""Optimization of TEM Sample Preparation to Reduce the Overlapping of TEM Images""; ""Delayering on Advanced Process Technologies using FIB""; ""Failure Analysis Enhancement by Incorporating a Compact Scan Diagnosis System""; ""Debugging Phase-Locked Loop Failures in Integrated Circuit Products""; ""A Novel Method for the Specified Site Planar View TEM Sample Preparation""; ""Investigation of Protection Layer Materials for Ex-situ âß?lift-outâß? TEM Sample Preparation with FIB for 14nm FinFET""
organized by Electronic Device Failure Analysis Society, ASM International.
ISTFA 2014 : conference proceedings from the 40th International Symposium for Testing and Failure Analysis ; November 9-13, 2014, George R. Brown Conversion Center, Houston, Texas, USA
International Symposium for Testing and Failure Analysis (40th : 2014 : Houston, Tex.).
Materials Park, Ohio : ASM International, ©2014