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Three-dimensional molded interconnect devices (3D-MID) : materials, Manufacturing, assembly, and applications for injection molded circuit carriers /

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Bibliographic Details
Main Author: Franke, Jörg, Dipl.-Ing (Author)
Corporate Author: Knovel (Firm)
Format: eBook
Language:English
Published: Munich ; Cincinnati, OH : Hanser, [2014]
Subjects:
Interconnects (Integrated circuit technology) > Design and construction.
Injection molding of plastics.
Electronic books.
Online Access:Connect to the full text of this electronic book
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