Three-dimensional molded interconnect devices (3D-MID) : materials, Manufacturing, assembly, and applications for injection molded circuit carriers /
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| Format: | eBook |
| Language: | English |
| Published: |
Munich ; Cincinnati, OH :
Hanser,
[2014]
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| Online Access: | Connect to the full text of this electronic book |
| Item Description: | Translated from the German. |
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| Physical Description: | 1 online resource (xii, 356 pages) : color illustrations |
| Bibliography: | Includes bibliographical references and index. |
| ISBN: | 9781569905524 1569905525 9781680157277 1680157272 |