Electromigration in thin films and electronic devices : materials and reliability /
Understanding and limiting electromigration in thin films is essential to the continued development of advanced copper interconnects for integrated circuits. Electromigration in thin films and electronic devices provides an up-to-date review of key topics in this commercially important area. Part on...
| Corporate Author: | Knovel (Firm) |
|---|---|
| Other Authors: | Kim, Choong-Un |
| Format: | eBook |
| Language: | English |
| Published: |
Oxford :
Woodhead Pub.,
2011.
|
| Series: | Woodhead Publishing in materials.
|
| Subjects: | |
| Online Access: | Connect to the full text of this electronic book |
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