APA (7th ed.) Citation

Knovel (Firm) & Kim, C. (2011). Electromigration in thin films and electronic devices: Materials and reliability. Woodhead Pub..

Chicago Style (17th ed.) Citation

Knovel (Firm) and Choong-Un Kim. Electromigration in Thin Films and Electronic Devices: Materials and Reliability. Oxford: Woodhead Pub., 2011.

MLA (9th ed.) Citation

Knovel (Firm) and Choong-Un Kim. Electromigration in Thin Films and Electronic Devices: Materials and Reliability. Woodhead Pub., 2011.

Warning: These citations may not always be 100% accurate.