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Lead-free solder interconnect reliability /

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Bibliographic Details
Corporate Author: Knovel (Firm)
Other Authors: Shangguan, Dongkai, 1963-
Format: eBook
Language:English
Published: Materials Park, OH : ASM International, 2005.
Subjects:
Microelectronic packaging > Reliability.
Solder and soldering.
Lead-free electronics manufacturing processes.
TECHNOLOGY & ENGINEERING > Electronics > Digital.
TECHNOLOGY & ENGINEERING > Electronics > Microelectronics.
Electronic books.
Online Access:Connect to the full text of this electronic book
Description
Item Description:Electronic resource.
Physical Description:1 online resource (x, 292 pages) : illustrations
Bibliography:Includes bibliographical references and index.
ISBN:9781615030934
161503093X