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MEMS packaging /

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Bibliographic Details
Corporate Authors: Knovel (Firm), INSPEC (Information service)
Other Authors: Hsu, Tai-Ran
Format: eBook
Language:English
Published: London : INSPEC, [2004]
Series:EMIS processing series ; no. 3.
Subjects:
Microelectromechanical systems.
Microelectronic packaging.
Micromachines.
Mise sous boîtier (Microélectronique)
Bauelement.
Mikroelektronik.
Mikromechanik.
Electronic books.
Online Access:Connect to the full text of this electronic book
Description
Item Description:Electronic resource.
Physical Description:1 online resource (xxix, 275 pages) : illustrations.
Format:Master and use copy. Digital master created according to Benchmark for Faithful Digital Reproductions of Monographs and Serials, Version 1. Digital Library Federation, December 2002.
Bibliography:Includes bibliographical references and index.
ISBN:9781849190626
1849190623
9781615839629
1615839623