http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
Practical guide to the packaging of electronics
thermal and mechanical design and analysis
1. Introduction -- 2. Basic heat transfer : conduction, convection, and radiation -- 3. Conductive cooling -- 4. Radiation cooling -- 5. Fundamentals of convection cooling -- 6. Combined modes, transient heat transfer, and advanced materials -- 7. Basics of vibration and its isolation -- 8. Basics of shock management -- 9. Induced stresses -- 10. The finite element methods -- 11. Mechanical and thermomechanical concerns -- 12. Acoustics -- 13. Mechanical failures and reliability -- 14. Electrical failures and reliability -- 15. Chemical attack failures and reliability concerns -- 16. Reliability models, predictions, and calculations -- 17. Design considerations in an avionics electronic package.
Includes bibliographical references and index.
Boca Raton : Taylor & Francis, CRC Press, 2016