3D IC devices, technologies, and manufacturing /

This book discusses the advantages of 3D devices and their applications in dynamic random access memory (DRAM), 3D-NAND flash, and advanced-technology-node CMOS ICs. Topics include the development of DRAM cell transistors and storage node capacitors; the manufacturing process of advanced buried-word...

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Bibliographic Details
Main Author:	Xiao, Hong, 1961- (Author)
Corporate Author:	SPIE (Society)
Format:	Book
Language:	English
Published:	Bellingham, Washington, USA : SPIE Press, [2016]
Subjects:	Three-dimensional integrated circuits.

Table of Contents:

Preface
Manufacturing processes of 3D IC devices
Introduction
3D devices in the DRAM and BWL DRAM process
Brief summary of DRAM
Review questions
3D-NAND flash and its manufacturing process
Introduction
3D-NAND flash memory manufacturing processes
3D-NAND summary and discussion
Review questions
High-k, metal-gate FinFET CMOS manufacturing process
Introduction
FinFET basics
FinFET process
Advanced FinFET CMOS process
Advanced FinFET SRAM
FinFET CMOS scaling
Review questions
Summary and future trends of the 3D IC process
Scaling MOSFET technology after 14 nm
Scaling and development of memory devices
3D packaging
Other 3D devices and 3D IC processing techniques
The end of Moore's Law?