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3D IC devices, technologies, and manufacturing /

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This book discusses the advantages of 3D devices and their applications in dynamic random access memory (DRAM), 3D-NAND flash, and advanced-technology-node CMOS ICs. Topics include the development of DRAM cell transistors and storage node capacitors; the manufacturing process of advanced buried-word...

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Bibliographic Details
Main Author:	Xiao, Hong, 1961- (Author)
Corporate Author:	SPIE (Society)
Format:	Book
Language:	English
Published:	Bellingham, Washington, USA : SPIE Press, [2016]
Subjects:	Three-dimensional integrated circuits.

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