rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    title: 3D IC devices, technologies, and manufacturing
  name:
    name part: Xiao, Hong
    name part: 1961-
    role:
      role term: creator
    role:
      role term: author.
  name:
    name part: SPIE (Society)
  type of resource: text
  genre: bibliography
  origin info:
    place:
      place term: wau
    date issued: 2016
    copyright date: 2016
    issuance: monographic
  language:
    language term: eng
  physical description:
    form: print
    extent: xi, 189 pages : color illustrations ; 26 cm
  abstract: This book discusses the advantages of 3D devices and their applications in dynamic random access memory (DRAM), 3D-NAND flash, and advanced-technology-node CMOS ICs. Topics include the development of DRAM cell transistors and storage node capacitors; the manufacturing process of advanced buried-word-line DRAM; 3D FinFET CMOS IC devices; scaling trends of CMOS logic; devices that may be used in the "post-CMOS" era; and 3D technologies, such as the 3D-wafer process integration of silicon-on-ILD and TSV-based 3D packaging.
  table of contents: Preface -- Manufacturing processes of 3D IC devices -- Introduction -- 3D devices in the DRAM and BWL DRAM process -- Brief summary of DRAM -- Review questions -- 3D-NAND flash and its manufacturing process -- Introduction -- 3D-NAND flash memory manufacturing processes -- 3D-NAND summary and discussion -- Review questions -- High-k, metal-gate FinFET CMOS manufacturing process -- Introduction -- FinFET basics -- FinFET process -- Advanced FinFET CMOS process -- Advanced FinFET SRAM -- FinFET CMOS scaling -- Review questions -- Summary and future trends of the 3D IC process -- Scaling MOSFET technology after 14 nm -- Scaling and development of memory devices -- 3D packaging -- Other 3D devices and 3D IC processing techniques -- The end of Moore's Law?
  note: Hong Xiao.
  note: Includes bibliographical references and index.
  subject:
    topic: Three-dimensional integrated circuits
  subject:
    topic: Three-dimensional integrated circuits
  classification: TK7874.893 .X53 2016
  classification: 621.3815
  related item:
    title info:
      title: 3D IC devices, technologies, and manufacturing
    name:
      name part: Xiao, Hong, 1961- author.
    origin info:
      publisher: Bellingham, Washington, USA : SPIE, [2016]
    identifier: (DLC) 2016014372
  identifier: 9781510601468
  identifier: 1510601465
  identifier: 2016006975
  record info:
    record content source: DLC
    record creation date: 160323
    record change date: 20160621144729.0
    record identifier: in00003766367
    language of cataloging:
      language term: eng