3D IC devices, technologies, and manufacturing /
This book discusses the advantages of 3D devices and their applications in dynamic random access memory (DRAM), 3D-NAND flash, and advanced-technology-node CMOS ICs. Topics include the development of DRAM cell transistors and storage node capacitors; the manufacturing process of advanced buried-word...
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| Format: | Book |
| Language: | English |
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Bellingham, Washington, USA :
SPIE Press,
[2016]
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| Summary: | This book discusses the advantages of 3D devices and their applications in dynamic random access memory (DRAM), 3D-NAND flash, and advanced-technology-node CMOS ICs. Topics include the development of DRAM cell transistors and storage node capacitors; the manufacturing process of advanced buried-word-line DRAM; 3D FinFET CMOS IC devices; scaling trends of CMOS logic; devices that may be used in the "post-CMOS" era; and 3D technologies, such as the 3D-wafer process integration of silicon-on-ILD and TSV-based 3D packaging. |
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| Physical Description: | xi, 189 pages : color illustrations ; 26 cm |
| Bibliography: | Includes bibliographical references and index. |
| ISBN: | 9781510601468 1510601465 |