APA (7th ed.) Citation

Hwang, J. S. (1989). Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly. Springer Netherlands.

Chicago Style (17th ed.) Citation

Hwang, Jennie S. Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly. Dordrecht: Springer Netherlands, 1989.

MLA (9th ed.) Citation

Hwang, Jennie S. Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly. Springer Netherlands, 1989.