rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    title: Area Array Interconnection Handbook
  name:
    name part: Puttlitz, Karl J.
    role:
      role term: creator
  name:
    name part: Totta, Paul A.
  name:
    name part: SpringerLink (Online service)
  type of resource: text
  genre: Electronic books.
  origin info:
    place:
      place term: mau
    date issued: 2001
    issuance: monographic
  language:
    language term: eng
  physical description:
    reformatting quality: access
    form: remote
    extent: 1 online resource (cxxxvi, 1764 pages)
  abstract: This handbook provides a comprehensive treatment of area-array interconnections for both chips and microelectronic packages in terms of optimizing densification, functionality and reliability. It provides comparisons with alternative and competing technologies, clearly defining cost versus benefit tradeoffs and strategies. Process details are defined in the order of their typical manufacturing sequence, indicating tooling requirements and potential yield detractors. In addition, the handbook has individual chapters devoted to supporting disciplines that play a key role in satisfying the requirements of microelectronic package applications: efficient thermal-dissipation techniques, metallurgical and mechanical characteristics of interconnections and electrical design strategies. Area-array technology at both die and chip carrier levels offers the best opportunity of satisfying the demanding performance requirements that users at all levels of the product spectrum have come to expect. This handbook fully describes the `how and why' of the inherent elements of area-array technology that give rise to enhanced electrical and thermal dissipation capabilities, and densification to accommodate demanding design requirements, while at the same time accommodating size and cost reductions to enhance comfort and portability. This handbook is the only book that provides a complete and integrated treatment which includes all the aspects of area-array microelectronics. Each chapter is self contained, written in a clear, concise, easy-to-understand manner. It sets forth fundamentals followed by the application of those principles making prior knowledge of the subject material unnecessary in order to utilize this reference. The handbook will serve as an excellent text or companion reference for a variety of electronic packaging courses or workshops. FEATURES: describes all the key elements of microelectronic packaging technology; organized into three categories: die, chip carrier, an…
  note: edited by Karl J. Puttlitz, Paul A. Totta.
  note: Electronic resource.
  subject:
    topic: Engineering
  subject:
    topic: Machinery
  subject:
    topic: Computer engineering
  subject:
    topic: Systems engineering
  subject:
    topic: Climatic changes
  subject:
    topic: Climatic changes
  subject:
    topic: Computer engineering
  subject:
    topic: Engineering
  subject:
    topic: Machinery
  subject:
    topic: Systems engineering
  classification: TK7888.4
  classification: 621.3815
  identifier: 9781461513896 (electronic bk.)
  identifier: 1461513898 (electronic bk.)
  identifier: 9781461355298
  identifier: 146135529X
  identifier: 1461513898
  identifier: http://proxy.library.tamu.edu/login
  record info:
    record content source: AU@
    record creation date: 121227
    record change date: 20260420200703.7
    record identifier: in00003570460
    language of cataloging:
      language term: eng