rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    title: Microelectronics Packaging Handbook
    sub title: Technology Drivers Part I
  name:
    name part: Tummala, Rao R.
    role:
      role term: creator
  name:
    name part: Rymaszewski, Eugene J.
  name:
    name part: Klopfenstein, Alan G.
  name:
    name part: SpringerLink (Online service)
  type of resource: text
  genre: Electronic books.
  origin info:
    place:
      place term: mau
    date issued: 1997
    edition: Second edition.
    issuance: monographic
  language:
    language term: eng
  physical description:
    reformatting quality: access
    form: remote
    extent: 1 online resource (xxvii, 720 pages)
  abstract: This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables. Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail. Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.
  note: edited by Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein.
  note: Electronic resource.
  subject:
    topic: Engineering
  subject:
    topic: Microprogramming
  subject:
    topic: Machinery
  subject:
    topic: Computer engineering
  subject:
    topic: Systems engineering
  subject:
    topic: Computer engineering
  subject:
    topic: Engineering
  subject:
    topic: Machinery
  subject:
    topic: Microprogramming
  subject:
    topic: Systems engineering
  classification: TK7888.4
  classification: 621.3815
  identifier: 9781461540861 (electronic bk.)
  identifier: 1461540860 (electronic bk.)
  identifier: 9781461368298
  identifier: 1461368294
  identifier: 1461540860
  identifier: http://proxy.library.tamu.edu/login
  record info:
    record content source: AU@
    record creation date: 121227
    record change date: 20260420212120.9
    record identifier: in00003564338
    language of cataloging:
      language term: eng