rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    title: Manufacturing Challenges in Electronic Packaging
  name:
    name part: Lee, Y. C.
    role:
      role term: creator
  name:
    name part: Chen, W. T.
  name:
    name part: SpringerLink (Online service)
  type of resource: text
  genre: Electronic books.
  origin info:
    place:
      place term: mau
    date issued: 1998
    issuance: monographic
  language:
    language term: eng
  physical description:
    reformatting quality: access
    form: remote
    extent: 1 online resource (xi, 261 pages)
  abstract: This book provides a single source reference that addresses both advanced packaging and manufacturing activities, enhanced by reviews and in-depth analysis. The common theme throughout the book is how to manufacture with only one defective package in a million escaping undetected. The book will become the most important reference for professionals who need to meet this goal through their design and manufacturing activities.
  note: by Y.C. Lee, W.T. Chen.
  note: Electronic resource.
  subject:
    topic: Engineering
  subject:
    topic: Machinery
  subject:
    topic: Engineering
  subject:
    topic: Machinery
  classification: TJ241
  classification: 670
  identifier: 9781461558033 (electronic bk.)
  identifier: 1461558034 (electronic bk.)
  identifier: 9781461376590
  identifier: 1461376599
  identifier: 1461558034
  identifier: http://proxy.library.tamu.edu/login
  record info:
    record content source: AU@
    record creation date: 121227
    record change date: 20260422152949.9
    record identifier: in00003559870
    language of cataloging:
      language term: eng