rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    title: Pulsed and pulsed bias sputtering
    sub title: principles and applications
  name:
    name part: Barnat, Edward V.
    role:
      role term: creator
  name:
    name part: Lu, T.-M. (Toh-Ming)
    name part: 1943-
  name:
    name part: SpringerLink (Online service)
  type of resource: text
  genre: bibliography
  genre: Electronic books.
  origin info:
    place:
      place term: mau
    date issued: 2003
    issuance: monographic
  language:
    language term: eng
  physical description:
    form: remote
    extent: 1 online resource (x, 155 pages) : illustrations.
  abstract: This book provides basic knowledge on the design of the instrumentation for pulsed and pulsed bias sputtering techniques as well as the knowledge for the control of thin film properties using the deposition parameters such as pulsing cycle and duty. The book focuses on the basic principles and experimentation of the pulsed and pulsed bias sputter deposition of thin films. The transient charging characteristics of the target in the DC reactive sputtering of insulator films and of the insulating substrate in the DC sputtering of metal films without the pulsing are discussed in detail. The predictions and experimentation of the discharging (neutralization) strategies using pulsing potentials are presented. Examples are given on the growth of thin films using these strategies and on the relationship between the film properties the pulsing parameters. In addition, the book also presents in a coherent manner the basic physics of DC plasma formation and the utilization of the plasma in the sputtering environment. The book will not only be useful for academic researchers but also for industrial scientists interested in sputter coating of high quality metal and insulating films.
  table of contents: Ch. 1. Introduction -- Ch. 2. Basic Plasma Phenomenon -- Ch. 3. Plasma Sources Used for Sputter Deposition -- Ch. 4. Response of a Plasma to an Applied Bias -- Ch. 5. Sinusoidal, Waveform -- Ch. 6. Pulsed Waveform -- Ch. 7. Application of a Pulsed Waveform to a Target: Pulsed Reactive Sputtering -- Ch. 8. Application of a Pulsed Waveform to a Substrate: Pulsed Bias Sputtering -- Ch. 9. Conclusions and Future Directions.
  note: by Edward V. Barnat, Toh-Ming Lu.
  note: Includes bibliographical references and index.
  subject:
    topic: Cathode sputtering (Plating process)
  subject:
    topic: Thin films
  subject:
    topic: Pulvérisation cathodique
    topic: Applications industrielles
  subject:
    topic: Couches minces
  subject:
    topic: Cathode sputtering (Plating process)
  subject:
    topic: Thin films
  classification: TS695 .B27 2003eb
  classification: 621.3815/2
  related item:
    title info:
      title: Pulsed and pulsed bias sputtering
    name:
      name part: Barnat, Edward V.
    identifier: (DLC) 2003054987
    identifier: (OCoLC)52464630
  identifier: 9781461504115 (electronic bk.)
  identifier: 1461504112 (electronic bk.)
  identifier: 140207543X
  identifier: 9781402075438
  identifier: http://proxy.library.tamu.edu/login
  record info:
    record content source: GW5XE
    record creation date: 140711
    record change date: 20260422172758.0
    record identifier: in00003555339
    language of cataloging:
      language term: eng