Thin-film capacitors for packaged electronics /
Thin-Film Capacitors for Packaged Electronics deals with the capacitors of a wanted kind, still needed and capable of keeping pace with the demands posed by ever greater levels of integration. It spans a wide range of topics, from materials properties to limits of what's the best one can achiev...
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| Format: | eBook |
| Language: | English |
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Boston :
Kluwer Academic Publishers,
[2004]
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| Online Access: | Connect to the full text of this electronic book |
Table of Contents:
- 1 Introduction
- 1.1 Capacitor Fundamentals
- 1.2 Application Domains
- 1.3 Physical Structures/Embodiments
- 1.4 Capacitor Integration Drivers
- 1.5 Thin-Film Capacitor Technology
- 1.6 Summary
- 1.7 References
- 2 Design Fundamentals
- 2.1 Breakdown Voltage and Capacitance Density Design Limits
- 2.2 Tolerance in Capacitance Density
- 2.3 DC Leakage
- 2.4 Capacitor Losses
- 2.5 Series Inductance and Resistance
- 2.6 References
- 3 Performance Detractors
- 3.1 Interfacial Micro-roughness
- 3.2 Deviation from Optimal Stoichiometry
- 3.3 Film Microstructure
- 3.4 References
- 4 Electrical Characterization
- 4.1 Thin Film Decoupling Capacitors
- 4.2 Characterization Methodologies
- 4.3 Test Vehicle: Design and Fabrication
- 4.4 Dielectric Constant and Loss
- 4.5 Total Series Inductance
- 4.6 Leakage Current Density
- 4.7 Capacitance Density and Breakdown Field
- 4.8 Summary and Conclusion
- 4.9 References
- 5 Integration Issues and Challenges
- 5.1 Metal Diffusion into Dielectrics
- 5.2 Interlayer Stresses and Adhesion
- 5.3 Low Thermal Budget
- 5.4 References
- 6 Applications
- 6.1 2D Interconnections in ICs
- 6.2 Integration into 2D Packaging
- 6.3 Flex Circuits
- 6.4 Large Area Power Distribution
- 6.5 Integration into 3D Structures
- 6.6 Electromagnetic Considerations
- 6.7 Power Electronics
- 6.8 References.