Foldable flex and thinned silicon multichip packaging technology /
Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages...
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| Format: | eBook |
| Language: | English |
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Boston :
Kluwer Academic Publishers,
[2003]
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| Series: | Emerging technology in advanced packaging series ;
1. |
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| Online Access: | Connect to the full text of this electronic book |
Table of Contents:
- About IMAPS / Peter Barnwell
- 3-D Assemblies of Stacked Chips and other Thin Packages / John Balde
- Multi-Chip Carriers in a System-on-a-Chip World / Evan Davidson
- Packaging Technologies for Flexible Systems / Catherine Kallmayer
- Low Profile and Flexible Electronic Assemblies Using Ultra-Thin Silicon
- The European Flex-Si Project / Thomas Harder
- Thin Chips for Flexible and 3-D Integrated Electronic Systems / Karlheinz Bock, Michael Feil, Christof Landesberger
- Flexible Microarray Interconnection Techniques Applied to Biomedical Microdevices / Jeorg-Uwe Meyer, Martin Schuetter, Oliver Scholz, Werner Haberer, Thomas Steiglitz
- Folded Flex and other Structures for System-in-a Package / Mike Warner, Bill Carlson
- Valtronic CSP3D Technology / Georges Rochat, Phillipe Clot, Jean-Francois Zeberti
- 3-D Packaging Technologies: Are Flex based Solutions the Answer? / Ted Tessier
- Availability of High Density Interconnect Flexible Circuits / E. Jan Vardaman, Dominique Numakura
- Recent Advances in Flexible Circuit Technology Using Liquid Crystal Polymer Substrates / Rui Yang, Terry F. Hayden
- Flex and the Interconnected Mesh Power System (IMPS) / Leonard W. Schaper
- Thermal Management and Control of Electromagnetic Emissions / Carl Zweben
- Conclusions / John Balde.