APA (7th ed.) Citation

SpringerLink (Online service) & Balde, J. W. (2003). Foldable flex and thinned silicon multichip packaging technology. Kluwer Academic Publishers.

Chicago Style (17th ed.) Citation

SpringerLink (Online service) and John W. Balde. Foldable Flex and Thinned Silicon Multichip Packaging Technology. Boston: Kluwer Academic Publishers, 2003.

MLA (9th ed.) Citation

SpringerLink (Online service) and John W. Balde. Foldable Flex and Thinned Silicon Multichip Packaging Technology. Kluwer Academic Publishers, 2003.

Warning: These citations may not always be 100% accurate.