Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication : From Particle Scale to Feature, Die and Wafer Scales /

This book is the product of a developing research focus on CMP at Berkeley. Its focus is on the important area of process models which have not kept pace with the tremendous expansion of applications of CMP. It specifically deals with the development of models with sufficient detail to allow the eva...

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Bibliographic Details
Main Author:	Luo, Jianfeng
Corporate Author:	SpringerLink (Online service)
Other Authors:	Dornfeld, D. A.
Format:	eBook
Language:	English
Published:	Berlin, Heidelberg : Springer Berlin Heidelberg, 2004.
Subjects:	Engineering. Physical organic chemistry. Electronics. Optical materials. Surfaces (Physics) Electronic books.
Online Access:	Connect to the full text of this electronic book

Table of Contents:

Introduction
Review of CMP Modeling
Material Removal Mechanism in CMP
Effects of Abrasive Size Distribution in CMP
Material Removal Regions in CMP
One and Semi-Two Dimensional Feature- and Die-Scale Modeling for the Damascene Process
Three-Dimensional Feature-Scale Modeling of CMP
Wafer-Scale Modeling of CMP
Summary and Future work.