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Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication : From Particle Scale to Feature, Die and Wafer Scales /

This book is the product of a developing research focus on CMP at Berkeley. Its focus is on the important area of process models which have not kept pace with the tremendous expansion of applications of CMP. It specifically deals with the development of models with sufficient detail to allow the eva...

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Bibliographic Details
Main Author: Luo, Jianfeng
Corporate Author: SpringerLink (Online service)
Other Authors: Dornfeld, D. A.
Format: eBook
Language:English
Published: Berlin, Heidelberg : Springer Berlin Heidelberg, 2004.
Subjects:
Engineering.
Physical organic chemistry.
Electronics.
Optical materials.
Surfaces (Physics)
Electronic books.
Online Access:Connect to the full text of this electronic book

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