APA (7th ed.) Citation

Luo, J., & Dornfeld, D. A. (2004). Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication: From Particle Scale to Feature, Die and Wafer Scales. Springer Berlin Heidelberg.

Chicago Style (17th ed.) Citation

Luo, Jianfeng, and D. A. Dornfeld. Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication: From Particle Scale to Feature, Die and Wafer Scales. Berlin, Heidelberg: Springer Berlin Heidelberg, 2004.

MLA (9th ed.) Citation

Luo, Jianfeng, and D. A. Dornfeld. Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication: From Particle Scale to Feature, Die and Wafer Scales. Springer Berlin Heidelberg, 2004.