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Microelectronic Interconnections and Assembly /

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The Workshop is devoted to the technical aspects of advanced interconnections and microassembly and also includes papers on the education issues needed to prepare students for work in these areas. The future direction that such technologies may take is also dealt with. <br/> The basic issue is...

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Bibliographic Details
Main Author: Harman, George
Corporate Author: SpringerLink (Online service)
Other Authors: Mach, Pavel
Format: eBook
Language:English
Published: Dordrecht : Springer Netherlands, 1998.
Series:NATO ASI Series, 3. High Technology, ; 54.
Subjects:
Microelectronic packaging > Congresses.
Microelectronic packaging.
Electronic books.
Conference proceedings.
Online Access:Connect to the full text of this electronic book

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