rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    title: Microelectronic Interconnections and Assembly
  title info:
    title: Proceedings of the NATO Advanced Research Workshop, Prague, Czech Republic, 18-21 May 1996
  name:
    name part: Harman, George.
    role:
      role term: creator
  name:
    name part: Mach, Pavel.
  name:
    name part: SpringerLink (Online service)
  type of resource: text
  genre: Electronic books.
  genre: Conference proceedings.
  origin info:
    place:
      place term: ne
    date issued: 1998
    issuance: monographic
  language:
    language term: eng
  physical description:
    form: remote
    extent: 1 online resource (314 pages)
  abstract: The Workshop is devoted to the technical aspects of advanced interconnections and microassembly and also includes papers on the education issues needed to prepare students for work in these areas. The future direction that such technologies may take is also dealt with. The basic issue is that the miniaturisation of electronic systems continues, and performance must continue to improve. The newest packages are often based on the selection of an appropriate interconnection method. Advances in chip-scale, chip-flip, and direct chip attachments are described. Although wire bonding currently dominates the market, the consensus is that flip chip interconnection will rapidly increase its market share. Tape automated bonding is also discussed, primarily for special applications. Solder metallurgy and flip chip production technology receive attention in several papers. Solderability, reliability and fatigue of the joints are modelled, and mechanical stresses resulting from temperature cycling are reported. Multichip module and thick-film hybrid substrate interconnections are reported in several papers. These include thick and thin film metals, as well as low temperature polymer inks. Several papers describe diffusion and other metallurgical interactions in thick film surfaces.
  note: edited by George Harman, Pavel Mach.
  note: Electronic resource.
  subject:
    topic: Microelectronic packaging
    genre: Congresses
  subject:
    topic: Microelectronic packaging
  classification: TK7874
  classification: 621.381/046
  related item:
    title info:
      title: NATO ASI Series, 3. High Technology, ; 54
  identifier: 9789401151351 (electronic bk.)
  identifier: 9401151350 (electronic bk.)
  identifier: http://proxy.library.tamu.edu/login
  record info:
    record content source: I9W
    record creation date: 121227
    record change date: 20260422170346.3
    record identifier: in00003545676
    language of cataloging:
      language term: eng