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Advances in electronic circuit packaging ; : proceedings /

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Bibliographic Details
Corporate Authors:	International Electronic Circuit Packaging Symposium Boulder, Colo., SpringerLink (Online service), University of Colorado (Boulder campus)
Other Authors:	Rosine, Lawrence L. (Editor)
Format:	Conference Proceeding eBook
Language:	English
Published:	1965.
Subjects:	Electronic packaging > Congresses. Encapsulation (électronique) > Congrès. Mise sous boîtier (électronique) > Congrès. Electronic packaging. Electronic books. Conference proceedings.
Online Access:	Connect to the full text of this electronic book

Cover Image

Advances in electronic circuit packaging ; proceedings /

Published 1965

Conference Proceeding Book

Cover Image

Advances in electronic circuit packaging ; proceedings /

Published 1965

Conference Proceeding Book

Cover Image

Advances in electronic circuit packaging ; proceedings /

Published 1964

Conference Proceeding Book

Cover Image

Advances in electronic circuit packaging ; proceedings /

Published 1963

Conference Proceeding Book

Cover Image

Advances in electronic circuit packaging ; proceedings /

Published 1962

Conference Proceeding Book

Cover Image

Advances in electronic circuit packaging ; proceedings /

Published 1962

Conference Proceeding Book