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Advances in electronic circuit packaging ; : proceedings /

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Bibliographic Details
Corporate Authors: International Electronic Circuit Packaging Symposium Boulder, Colo., SpringerLink (Online service), University of Colorado (Boulder campus)
Other Authors: Rosine, Lawrence L. (Editor)
Format: Conference Proceeding eBook
Language:English
Published: 1965.
Subjects:
Electronic packaging > Congresses.
Encapsulation (électronique) > Congrès.
Mise sous boîtier (électronique) > Congrès.
Electronic packaging.
Electronic books.
Conference proceedings.
Online Access:Connect to the full text of this electronic book
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