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Rapid thermal processing of semiconductors /

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Rapid thermal processing has contributed to the development of single wafer cluster processing tools and other innovations in integrated circuit manufacturing environments. Borisenko and Hesketh review theoretical and experimental progress in the field, discussing a wide range of materials, processe...

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Bibliographic Details
Main Authors: Borisenko, V. E. (Viktor Evgenʹevich) (Author), Hesketh, P. J. (Peter J.) (Author)
Corporate Author: SpringerLink (Online service)
Format: eBook
Language:English
Published: New York : Springer Science+Business Media, LLC, [1997]
Series:Microdevices.
Subjects:
Semiconductors > Design and construction.
Rapid thermal processing.
Semiconducteurs > Conception et construction.
Recuit thermique rapide.
Semiconducteurs > Traitement thermique.
Silicium.
Semiconducteurs > Dopage.
Halbleiter.
Supraleiter.
Thermische Verfahrenstechnik.
Electronic books.
Online Access:Connect to the full text of this electronic book
Description
Summary:Rapid thermal processing has contributed to the development of single wafer cluster processing tools and other innovations in integrated circuit manufacturing environments. Borisenko and Hesketh review theoretical and experimental progress in the field, discussing a wide range of materials, processes, and conditions. They thoroughly cover the work of international investigators in the field.
Item Description:Originally published by Plenum Press, New York in 1997.
"Softcover reprint of the hardcover 1st edition 1997"--Title page verso.
Physical Description:1 online resource (xxii, 358 pages) : illustrations.
Bibliography:Includes bibliographical references (pages 301-353) and index.
ISBN:9781489918048 (electronic bk.)
1489918043 (electronic bk.)