Package electrical modeling, thermal modeling, and processing for GaAs wireless applications /

Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications reviews the practical aspects of electrical and thermal modeling of packages and has no equivalent on the market, since it discusses analog (microwave) packaging as opposed to digital packaging. This book em...

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Bibliographic Details
Main Author:	Monthei, Dean L., 1958-
Corporate Author:	SpringerLink (Online service)
Format:	eBook
Language:	English
Published:	Boston : Kluwer Academic, [1999]
Series:	Electronic packaging and interconnects series.
Subjects:	Electronic packaging. Gallium arsenide semiconductors > Design and construction. Wireless communication systems > Equipment and supplies. Elektronisches Bauelement. Galliumarsenid. Kommunikationssystem. Electronic books.
Online Access:	Connect to the full text of this electronic book

Table of Contents:

I High Frequency Issues
1 Tutorial On Microwave Concepts
2 The Smith Chart and S-Parameters
II Electrical Modeling of Packages
3 Equivalent Circuit Models
4 Creating Models From Measurements
5 Creating a Model Using Em Simulators
III Thermal Modeling
6 Basics of Thermal Analysis
7 Quick Thermal Analysis
8 Finite Element Analysis
9 Computational Fluid Dynamics
10 Transient Thermal
11 Thermal Measurements
IV Processing Issues With Packaging Gaas High Frequency Components
12 Package Families for Wireless
13 Optimizing Electrical Performance
14 Production Process Issues
15 Die Attach Issues
Appendix A Electrical Conductivities of Packaging Materials
Appendix B Dielectric Properties of Packaging Materials
Appendix C Thermal Conductivities of Packaging Materials
Appendix D Thermal Modeling Software And Information
Appendix E Thermal Analysis Equipment And Materials
Appendix F Electromagnetic Simulator Software
Appendix G Electrical Probing Tools
Appendix H Circuit Simulator Software.