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Package electrical modeling, thermal modeling, and processing for GaAs wireless applications /

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Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications reviews the practical aspects of electrical and thermal modeling of packages and has no equivalent on the market, since it discusses analog (microwave) packaging as opposed to digital packaging. This book em...

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Bibliographic Details
Main Author: Monthei, Dean L., 1958-
Corporate Author: SpringerLink (Online service)
Format: eBook
Language:English
Published: Boston : Kluwer Academic, [1999]
Series:Electronic packaging and interconnects series.
Subjects:
Electronic packaging.
Gallium arsenide semiconductors > Design and construction.
Wireless communication systems > Equipment and supplies.
Elektronisches Bauelement.
Galliumarsenid.
Kommunikationssystem.
Electronic books.
Online Access:Connect to the full text of this electronic book

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