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Advanced wirebond interconnection technology /

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Bibliographic Details
Main Author: Prasad, Shankara K.
Corporate Author: SpringerLink (Online service)
Format: eBook
Language:English
Published: Boston : Kluwer Academic Publishers, [2004]
Subjects:
Wire bonding (Electronic packaging) > Production control.
Electronic packaging > Reliability.
TECHNOLOGY & ENGINEERING > Electronics > Microelectronics.
TECHNOLOGY & ENGINEERING > Electronics > Digital.
Electronic books.
Online Access:Connect to the full text of this electronic book
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by Prasad, Shankara K.
Published 2004
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