Cover Image

Advanced wirebond interconnection technology /

Show other versions (1)
Bibliographic Details
Main Author: Prasad, Shankara K.
Corporate Author: SpringerLink (Online service)
Format: eBook
Language:English
Published: Boston : Kluwer Academic Publishers, [2004]
Subjects:
Wire bonding (Electronic packaging) > Production control.
Electronic packaging > Reliability.
TECHNOLOGY & ENGINEERING > Electronics > Microelectronics.
TECHNOLOGY & ENGINEERING > Electronics > Digital.
Electronic books.
Online Access:Connect to the full text of this electronic book
Description
Item Description:Electronic resource.
Physical Description:1 online resource (xxviii, 668 pages) : illustrations
Bibliography:Includes bibliographical references (pages 655-660) and index.
ISBN:1402077637
9781402077630