Proceedings, sixth international symposium : moisture and creep effects on paper, board, and containers : Madison, Wisconsin, USA, 14-15 July 2009 /

Bibliographic Details
Corporate Authors:	Forest Products Laboratory (U.S.), Technical Association of the Pulp and Paper Industry. International Paper Physics Committee
Other Authors:	Considine, John M., Ralph, Sally A.
Format:	Government Document eBook
Language:	English
Published:	[Madison, Wis.] : U.S. Dept. of Agriculture, Forest Service, Forest Products Laboratory, [2011]
Series:	General technical report FPL ; 196.
Subjects:	Paper products > Creep > Congresses. Paper products > Moisture > Congresses. Paper products > Mechanical properties > Congresses.
Online Access:	https://purl.fdlp.gov/GPO/gpo15968

Description
Item Description:	Title from title screen (viewed on Dec. 5, 2011). "February, 2011"--P. [2] of cover. Electronic resource.
Physical Description:	1 online resource (166 pages) : illustrations (some color).
Bibliography:	Includes bibliographical references.