Handbook of wafer bonding /

Bibliographic Details
Other Authors:	Lu, James Jian-Qiang, Ramm, Peter, Taklo, Maaike M. V.
Format:	eBook
Language:	English
Published:	Weinheim : Wiley-VCH, [2012]
Series:	Wiley online library.
Subjects:	Semiconductor wafers > Handbooks, manuals, etc. Semiconductors > Bonding > Handbooks, manuals, etc. Electronic books.
Online Access:	Connect to the full text of this electronic book

Description
Item Description:	Electronic resource. Written by an author and editor team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies.In the first part, researchers from companies and institutions around the world discuss the most reliable and reproducible technologies for the production of bonded wafers. The second part is devoted to current and emerging applications, including microresonators, biosensors and precise measuring devices.
Physical Description:	1 online resource (xxxi, 395 pages)
ISBN:	3527644229 (electronic bk.) 9783527644223 (electronic bk.)
DOI:	10.1002/9783527644223