Lead free solder : mechanics and reliability /

Bibliographic Details
Main Author:	Pang, John Hock Lye
Corporate Author:	ebrary, Inc
Format:	eBook
Language:	English
Published:	New York : Springer, 2012.
Subjects:	Lead-free electronics manufacturing processes. Solder and soldering. Electronic books.
Online Access:	Connect to the full text of this electronic book

Description
Item Description:	Electronic resource.
Physical Description:	x, 175 pages : illustrations (some color)
Bibliography:	Includes bibliographical references and index.