rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    title: Advances in CMP/polishing technologies for the manufacture of electronic devices
  name:
    name part: Doi, Toshiro.
  name:
    name part: Marinescu, Ioan D.
  name:
    name part: Kurokawa, Syuhei.
  name:
    name part: ScienceDirect (Online service)
  type of resource: text
  genre: Electronic books.
  origin info:
    place:
      place term: enk
    date issued: 2012
    edition: 1st ed.
    issuance: monographic
  language:
    language term: eng
  physical description:
    form: remote
    extent: 1 online resource.
  abstract: CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. This title presents the developments and technological innovations in the field - making R&D accessible to the wider engineering community.
  note: edited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa.
  note: Includes index.
  note: Electronic resource.
  subject:
    topic: Electrolytic polishing
  subject:
    topic: Grinding and polishing
  classification: TS670 .A386 2012eb
  classification: 671.7/2
  related item:
    title info:
      title: ScienceDirect e-book
  identifier: 9781437778595
  identifier: 1437778593
  identifier: http://proxy.library.tamu.edu/login
  record info:
    record content source: HKP
    record creation date: 111222
    record change date: 20260609193352.1
    record identifier: in00002720718