http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
Advances in CMP/polishing technologies for the manufacture of electronic devices
CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. This title presents the developments and technological innovations in the field - making R&D accessible to the wider engineering community.
edited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa.