Cover Image

Adhesives technology for electronic applications : materials, processing, reliability /

Show other versions (4)
Bibliographic Details
Main Author: Licari, James J.
Corporate Author: ebrary, Inc
Other Authors: Swanson, Dale W.
Format: eBook
Language:English
Published: Boston : Elsevier, [2011]
Edition:2nd ed.
Series:Materials and processes for electronic applications series.
Subjects:
Electronics > Materials.
Adhesives.
Electronic packaging.
Electronic books.
Online Access:Connect to the full text of this electronic book
Description
Item Description:Electronic resource.
Physical Description:viii, 403 pages : illustrations ; 24 cm.
Bibliography:Includes bibliographical references and index.