rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    title: Moisture sensitivity of plastic packages of IC devices
  name:
    name part: Fan, X. J.
  name:
    name part: Suhir, Ephraim.
  name:
    name part: SpringerLink (Online service)
  type of resource: text
  genre: bibliography
  genre: Electronic books.
  origin info:
    place:
      place term: nyu
    date issued: 2010
    issuance: monographic
  language:
    language term: eng
  physical description:
    form: remote
    extent: xvii, 570 pages : illustrations
  note: X.J. Fan, E. Suhir, editors ; foreword by C.P. Wong.
  note: Electronic resource.
  note: Electronic reproduction. New York : Springer, 2010. Mode of access: World Wide Web. System requirements: Web browser. Title from title screen (viewed on Aug. 9, 2010). Access may be restricted to users at subscribing institutions.
  note: Includes bibliographical references and index.
  subject:
    topic: Electronic packaging
    topic: Moisture
  subject:
    topic: Plastics in packaging
    topic: Moisture
  classification: TK7870.15 .M65 2010
  classification: 621.381/046
  related item:
    title info:
      title: Micro- and opto-electronic materials, structures, and systems
  identifier: 1441957197
  identifier: 9781441957191
  identifier: 978-1-4419-5718-4 Springer
  identifier: http://proxy.library.tamu.edu/login
  record info:
    record content source: GW5XE
    record creation date: 100909
    record change date: 20210727155025.0
    record identifier: in00002657093
    language of cataloging:
      language term: eng