APA (7th ed.) Citation

Huang, C., & Suh, C. S. (2010). Short-time scale dynamic failure modes in a through-silicon-via (TSV) flip-chip configuration. [Texas A&M University].

Chicago Style (17th ed.) Citation

Huang, Chang-Chia, and Chii-Der S. Suh. Short-time Scale Dynamic Failure Modes in a Through-silicon-via (TSV) Flip-chip Configuration. [College Station, Tex.]: [Texas A&M University], 2010.

MLA (9th ed.) Citation

Huang, Chang-Chia, and Chii-Der S. Suh. Short-time Scale Dynamic Failure Modes in a Through-silicon-via (TSV) Flip-chip Configuration. [Texas A&M University], 2010.