Cover Image

Copper interconnect technology /

Bibliographic Details
Main Author: Gupta, Tapan
Corporate Author: SpringerLink (Online service)
Format: eBook
Language:English
Published: Dordrecht ; New York : Springer, [2009]
Subjects:
Copper.
Interconnects (Integrated circuit technology)
Microelectronics.
Electronic books.
Online Access:Connect to the full text of this electronic book
Description
Item Description:Electronic resource.
Physical Description:xix, 423 pages : illustrations ; 25 cm.
Bibliography:Includes bibliographical references and index.
ISBN:1441900764
9781441900760
DOI:10.1007/978-1-4419-0076-0