RF and microwave microelectronics packaging /

Bibliographic Details

Corporate Author:	SpringerLink (Online service)
Other Authors:	Cahill, Sean S., Kim, Franklin, Kuang, Ken
Format:	eBook
Language:	English
Published:	New York ; London : Springer, 2009.
Subjects:	Microelectronic packaging. Electronic books.
Online Access:	Connect to the full text of this electronic book