Wafer level 3-D ICs process technology /

Bibliographic Details
Corporate Author:	SpringerLink (Online service)
Other Authors:	Gutmann, Ronald J., Reif, Rafael, Tan, Chuan Seng
Format:	eBook
Language:	English
Published:	New York ; London : Springer, 2008.
Series:	Series on integrated circuits and systems.
Subjects:	Integrated circuits > Wafer-scale integration. Electronic books.
Online Access:	Connect to the full text of this electronic book