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Encapsulation technologies for electronic applications /

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Bibliographic Details
Main Author: Ardebili, Haleh
Other Authors: Pecht, Michael
Format: Book
Language:English
Published: Burlington, Mass. : William Andrew, 2009.
Series:Materials and processes for electronic applications series.
Subjects:
Electronic apparatus and appliances > Plastic embedment.
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by Ardebili, Haleh
Published 2009
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by Ardebili, Haleh
Published 2009
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