Cover Image

Thermal characterization of thin films for MEMS applications /

Bibliographic Details
Main Author:	Howe, David J.
Corporate Author:	U.S. Army Research Laboratory
Other Authors:	Morgan, Brian
Format:	Government Document Book
Language:	English
Published:	Adelphi, Md. : Army Research Laboratory, [2008]
Series:	ARL-TR (Aberdeen Proving Ground, Md.) ; 4378.
Subjects:	Microelectromechanical systems.
Online Access:	https://purl.fdlp.gov/GPO/LPS113054

Similar Items

A piezoelectric MEMS microphone based on lead zirconate titanate (PZT) thin films /
by: Polcawich, Ronald G.
Published: (2004)

Reliability, testing, and characterization of MEMS/MOEMS : 22-24 October 2001, San Francisco, USA /
Published: (2001)

Reliability, testing, and characterization of MEMS/MOEMS III : 26-28 January 2004, San Jose, California, USA /
Published: (2004)

Reliability, testing, and characterization of MEMS/MOEMS II : 27-29 January 2003, San Jose, California, USA /
Published: (2003)

Fast simulation of electro-thermal MEMS : efficient dynamic compact models /
by: Bechtold, T. (Tamara)
Published: (2007)

Foundations of MEMS /
by: Liu, Chang, Ph.D
Published: (2006)

Electromechanics and MEMS /
by: Jones, T. B. (Thomas Byron), 1944-
Published: (2013)

Reliability, packaging, testing, and characterization of MEMS/MOEMS IV : 24-25 January 2005, San Jose, California, USA /
Published: (2005)

MEMS for automotive and aerospace applications /
Published: (2013)

Fabrication and testing of a novel MEMS rotational thermal actuator /
by: Gee, Danny
Published: (2007)

Electroceramic-based MEMS : fabrication-technology and applications /
Published: (2005)

MEMS and NEMS : systems, devices, and structures /
by: Lyshevski, Sergey Edward
Published: (2002)

Reliability of MEMS /
Published: (2008)

Reliability of MEMS /
Published: (2008)

MEMs reliability /
by: Hartzell, Allyson L.
Published: (2011)

MEMS and MOEMS : technology and applications /
Published: (2000)

MEMS : applications /
Published: (2006)

Reliability, packaging, testing, and characterization of MEMS/MOEMS VII : 21-22 January 2008, San Jose, California, USA /
Published: (2008)

Reliability, packaging, testing, and characterization of MEMS/MOEMS V : 25-26 January 2006, San Jose, California, USA /
Published: (2006)

Reliability, packaging, testing, and characterization of MEMS/MOEMS VI : 23-24 January 2007, San Jose, California, USA /
Published: (2007)

Handbook of MEMS for wireless and mobile applications /
Published: (2013)

Handbook of silicon based MEMS : materials & technologies /
Published: (2010)

MEMS Cost Analysis : From Laboratory to Industry.

Materials & process integration for MEMS /
Published: (2002)

MEMS : a practical guide to design, analysis, and applications /
Published: (2006)

Ceramic thick films for MEMS and microdevices /
by: Dorey, Robert A.
Published: (2011)

MEMS packaging /
Published: (2004)

MEMS mechanical sensors /
Published: (2004)

Advances in multiphysics simulation and experimental testing of MEMS /
Published: (2008)

Microengineering, MEMS, and interfacing : a practical guide /
by: Banks, Danny
Published: (2006)

Handbook of silicon based MEMS : materials & technologies /
Published: (2010)

MEMS cost analysis : from laboratory to industry /
by: Lawes, Ronald A.
Published: (2014)

MEMS reliability for critical applications : 20 September 2000, Santa Clara, USA /
Published: (2000)

MEMS reliability for critical and space applications : 21-22 September 1999, Santa Clara, California /
Published: (1999)

Design, characterization, and packaging for MEMS and microelectronics : 27-29 October 1999, Royal Pines Resort, Queensland, Australia /
Published: (1999)

Analysis and design principles of MEMS devices /
by: Bao, Min-Hang
Published: (2005)

Post-processing techniques for integrated MEMS /
by: Sedky, Sherif
Published: (2006)

Analysis and design principles of MEMS devices /
by: Bao, Min-Hang
Published: (2005)

Handbook of silicon based MEMS materials and technologies /
Published: (2010)

RF MEMS and their applications /
by: Varadan, V. K., 1943-
Published: (2003)