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Force sensors for microelectronic packaging applications /

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Bibliographic Details
Main Author: Schwizer, J.
Corporate Author: SpringerLink (Online service)
Other Authors: Brand, Oliver, 1964-, Mayer, M.
Format: eBook
Language:English
Published: Berlin ; London : Springer, 2005.
Series:Microtechnology and MEMS.
Subjects:
Microelectronic packaging.
Drahtbonden > Prozessüberwachung > Kraftsensor > Flip-Chip-Technologie.
Flip-Chip-Technologie > Drahtbonden > Prozessüberwachung > Kraftsensor.
Kraftsensor > Prozessüberwachung > Drahtbonden > Flip-Chip-Technologie.
Prozessüberwachung > Kraftsensor > Drahtbonden > Flip-Chip-Technologie.
Electronic books.
Online Access:Connect to the full text of this electronic book
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by Schwizer, Jürg
Published 2005
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