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Force sensors for microelectronic packaging applications /

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Bibliographic Details
Main Author: Schwizer, J.
Corporate Author: SpringerLink (Online service)
Other Authors: Brand, Oliver, 1964-, Mayer, M.
Format: eBook
Language:English
Published: Berlin ; London : Springer, 2005.
Series:Microtechnology and MEMS.
Subjects:
Microelectronic packaging.
Drahtbonden > Prozessüberwachung > Kraftsensor > Flip-Chip-Technologie.
Flip-Chip-Technologie > Drahtbonden > Prozessüberwachung > Kraftsensor.
Kraftsensor > Prozessüberwachung > Drahtbonden > Flip-Chip-Technologie.
Prozessüberwachung > Kraftsensor > Drahtbonden > Flip-Chip-Technologie.
Electronic books.
Online Access:Connect to the full text of this electronic book
Description
Item Description:Electronic resource.
Physical Description:viii, 178 pages : illustrations ; 25 cm.
Bibliography:Includes bibliographical references and index.
ISBN:3540269452
9783540269458
DOI:10.1007/b138345