Cover Image

Integrated circuit packaging, assembly and interconnections /

Bibliographic Details
Main Author: Greig, William J.
Corporate Author: SpringerLink (Online service)
Format: eBook
Language:English
Published: New York ; London : Springer, 2007.
Subjects:
Integrated circuits industry.
Integrated circuits.
Electronic books.
Online Access:Connect to the full text of this electronic book
Description
Item Description:Electronic resource.
Physical Description:xxiv, 296 pages : illustrations ; 25 cm.
Bibliography:Includes bibliographical references and index.
ISBN:0387339132
9780387339139
DOI:10.1007/0-387-33913-2