Lead-free electronic solders : a special issue of Journal of Materials Science: Materials in Electronics /
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| Format: | eBook |
| Language: | English |
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New York :
Springer Science+Business,
2007.
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| Online Access: | Connect to the full text of this electronic book |
Table of Contents:
- Thermodynamics and phase diagrams of lead-free solder materials / H. Ipser, et. al.
- Phase diagrams of Pb-free solders and their related materials systems / Sinn-Wen Chen, et. al.
- Effects of suppressed beta tin nucleation on the microstructural evolution of lead-free solder joints / D. Swenson
- Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications / Iver E. Anderson
- Rare earth additions to lead-free electronic solders / C. M. L. Wu, et. al.
- Compression stress-strain and creep properties of the 52ln-48Sn and 97lm-3Ag low-temperature Pb-free solders / Paul T. Vianco, et. al.
- Sn-Zn low temperature solder / Katsuki Suganuma, et. al.
- Composite lead-free electronic solders / Fu Guo
- Processing and material issues related to lead-free soldering / Laura J. Turbini
- Interfacial reaction issues for lead-free electronic solders / C. E. Ho, et. al.
- Microstructure-based modeling of deformation in Sn-rich (Pb-free) solder alloys / N. Chawla, et. al.
- Deformation behavior of tin and some tin alloys / Fuqian Yang, et al.
- Mechanical fatigue of Sn-rich Pb-free solder alloys / J. K. Shang, et. al.
- Life expectancies of Pb-free SAC solder interconnects in electronic hardware / Michael Osterman, et. al.
- Assessment of factors influencing thermomechanical fatigue behavior of Sn-based solder joints under severe service environments / K. N. Subramanian
- Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages / Seung-Hyun Chae, et. al.
- Electromigration issues in lead-free solder joints / Chih Chen, et. al.
- Stress analysis of spontaneous Sn whisker growth / K. N. Tu, et. al.
- Sn-whiskers: truths and myths / J. W. Osenbach, et. al.
- Tin pest issues in lead-free electronic solders / W. J. Plumbridge
- Issues related to the implementation of Pb-free electronic solders in consumer electronics / D. R. Frear
- Impact of the ROHS Directive on high-performance electronic systems Part I: need for lead utilization in exempt systems / Karl J. Puttlitz, et. al.
- Impact of the ROHS Directive on high-performance electronic systems Part II: key reliability issues preventing the implementation of lead-free solders / Karl J. Puttlitz, et. al.