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| 008 |
080103s2007 xxua sbi 000 0 eng d |
| 020 |
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|a 0387484337
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| 020 |
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|a 9780387484334
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| 035 |
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|a (OCoLC)186986013
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| 035 |
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|a (OCoLC)ocn186986013
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| 037 |
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|a 978-0-387-48431-0
|b Springer
|n http://www.springerlink.com
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| 040 |
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|a GW5XE
|c GW5XE
|d GW5XE
|d YDXCP
|d UtOrBLW
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|a TEFA
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|a TK7836
|b .L42 2007eb
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| 082 |
0 |
4 |
|a 621.381
|2 22
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| 245 |
0 |
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|a Lead-free electronic solders :
|b a special issue of Journal of Materials Science: Materials in Electronics /
|c edited by K. N. Subramanian.
|
| 264 |
|
1 |
|a New York :
|b Springer Science+Business,
|c 2007.
|
| 300 |
|
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|a vi, 375 pages :
|b illustrations ;
|c 26 cm.
|
| 336 |
|
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|a text
|b txt
|2 rdacontent
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| 337 |
|
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|a computer
|b c
|2 rdamedia
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| 338 |
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|a online resource
|b cr
|2 rdacarrier
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| 500 |
|
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|a "This book contains the papers that were invited for a special issue of Journal of Materials Science: Materials in Electronics...to provide wider awareness of the current status of lead-free electronic solders..."--Preface.
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| 500 |
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|a Electronic resource.
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| 504 |
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|a Includes bibliographical references and index.
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| 505 |
0 |
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|t Thermodynamics and phase diagrams of lead-free solder materials /
|r H. Ipser, et. al. --
|t Phase diagrams of Pb-free solders and their related materials systems /
|r Sinn-Wen Chen, et. al. --
|t Effects of suppressed beta tin nucleation on the microstructural evolution of lead-free solder joints /
|r D. Swenson -- Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications /
|r Iver E. Anderson --
|t Rare earth additions to lead-free electronic solders /
|r C. M. L. Wu, et. al. --
|t Compression stress-strain and creep properties of the 52ln-48Sn and 97lm-3Ag low-temperature Pb-free solders /
|r Paul T. Vianco, et. al. --
|t Sn-Zn low temperature solder /
|r Katsuki Suganuma, et. al. --
|t Composite lead-free electronic solders /
|r Fu Guo --
|t Processing and material issues related to lead-free soldering /
|r Laura J. Turbini --
|t Interfacial reaction issues for lead-free electronic solders /
|r C. E. Ho, et. al. --
|t Microstructure-based modeling of deformation in Sn-rich (Pb-free) solder alloys /
|r N. Chawla, et. al. --
|t Deformation behavior of tin and some tin alloys /
|r Fuqian Yang, et al. --
|t Mechanical fatigue of Sn-rich Pb-free solder alloys /
|r J. K. Shang, et. al. --
|t Life expectancies of Pb-free SAC solder interconnects in electronic hardware /
|r Michael Osterman, et. al. --
|t Assessment of factors influencing thermomechanical fatigue behavior of Sn-based solder joints under severe service environments /
|r K. N. Subramanian --
|t Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages /
|r Seung-Hyun Chae, et. al. --
|t Electromigration issues in lead-free solder joints /
|r Chih Chen, et. al. --
|t Stress analysis of spontaneous Sn whisker growth /
|r K. N. Tu, et. al. --
|t Sn-whiskers: truths and myths /
|r J. W. Osenbach, et. al. --
|t Tin pest issues in lead-free electronic solders /
|r W. J. Plumbridge --
|t Issues related to the implementation of Pb-free electronic solders in consumer electronics /
|r D. R. Frear --
|t Impact of the ROHS Directive on high-performance electronic systems Part I: need for lead utilization in exempt systems /
|r Karl J. Puttlitz, et. al. --
|t Impact of the ROHS Directive on high-performance electronic systems Part II: key reliability issues preventing the implementation of lead-free solders /
|r Karl J. Puttlitz, et. al.
|
| 533 |
|
|
|a Electronic reproduction.
|b New York :
|c Springer,
|d 2007.
|n Mode of access: World Wide Web.
|n System requirements: Web browser.
|n Title from title screen (viewed on Dec. 13, 2007).
|n Access may be restricted to users at subscribing institutions.
|
| 650 |
|
0 |
|a Electronics
|x Materials.
|0 http://id.loc.gov/authorities/subjects/sh85042388
|
| 650 |
|
0 |
|a Lead-free electronics manufacturing processes
|x Research.
|
| 650 |
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0 |
|a Solder and soldering
|x Design and construction.
|
| 650 |
|
0 |
|a Solder and soldering
|x Testing.
|
| 655 |
|
7 |
|a Electronic books.
|2 local
|
| 700 |
1 |
|
|a Subramanian, K. N.
|0 http://id.loc.gov/authorities/names/n86069679
|
| 710 |
2 |
|
|a SpringerLink (Online service)
|0 http://id.loc.gov/authorities/names/no2005046756
|
| 730 |
0 |
|
|a Journal of Materials Science.
|
| 776 |
1 |
|
|c Original
|z 0387484310
|z 9780387484310
|w (DLC) 2006935131
|w (OCoLC)140839712
|
| 856 |
4 |
0 |
|u http://proxy.library.tamu.edu/login?url=https://dx.doi.org/10.1007/978-0-387-48433-4
|z Connect to the full text of this electronic book
|t 0
|
| 938 |
|
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|a YBP Library Services
|b YANK
|n 2717434
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| 994 |
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|a C0
|b TEF
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|a MARS
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|i 6b4c8352-133f-36f6-8a49-bd159c5a1597
|t 0
|
| 952 |
f |
f |
|a Texas A&M University
|b College Station
|c Electronic Resources
|d Available Online
|t 0
|e TK7836 .L42 2007eb
|h Library of Congress classification
|
| 998 |
f |
f |
|a TK7836 .L42 2007eb
|t 0
|l Available Online
|