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Mechanics of microelectronics /

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Bibliographic Details
Main Author: Zhang, G. Q.
Other Authors: Driel, W. D. van, Fan, X. J.
Format: Book
Language:English
Published: Dordrecht : Springer, 2006.
Series:Solid mechanics and its applications ; v. 141.
Subjects:
Microelectronics.
Mechanical engineering.
Online Access:Table of contents only
Publisher description
Table of Contents:
  • Preface
  • Microelectronics technology
  • Reliability practice
  • Thermal management
  • Introduction to advanced mechanics
  • Thermo-mechanics of integrated circuits and packages
  • Characterization and modelling of moisture behaviour
  • Characterization and modelling of solder joint reliability
  • Virtual thermo-mechanical prototyping
  • Challenges and future perspectives.